Key features

• Does not require cold storage or preheating
• No‑clean flux, clear and low residue
• Excellent wetting and solderability
• Compatible with most PCB surfaces

Technical specifications

• Solder alloy: Sn96,5 / Ag3,0 / Cu0,5 (SAC305)
• Particle size: T4 (20–38 µm)
• Metal content: 88,5 % by weight
• Melting point: 217–220 °C
• Flux classification: ROL0, synthetic no‑clean
• Printing speed: 25–125 mm/s

Storage and use

• Store at room temperature 20–25 °C
• Do not freeze
• Shelf life at least 12 kuukautta
• Recommended to stir for 2–3 minuuttia before use

Packaging

• 50 g purkki

Standards and compliance

• Meets J‑STD‑004, J‑STD‑005 and J‑STD‑006 requirements
• RoHS 3 and REACH compatible