MIXED-PAD PROTOTYPE BOARD WITH DOTS AND STRIPS

• suitable for circuits built from a few DIP-packaged ICs
• silkscreen on the component side matching the copper side
• solder strips grouped into runs of three- and two-hole lengths
• runs in the center of the board running end-to-end, e.g. for ground and supply voltage
• 3.5 mm mounting holes at the board edges
• pad holes Ø 1.0 mm
• thickness 1.5 mm
• 2.54 mm pitch